Perkins Coie LLP
Phone: (206) 359.6889
J.D., University of Washington School of Law, 2003; Intellectual Property, high honors, The Order of Barristers, The Order of the Coif
Ph.D., Mathematics, California Institute of Technology, 1994
M.S., Mathematics, California Institute of Technology, 1991
B.A., Mathematics, Vassar College, Phi Beta Kappa, 1989
Kaustuv M. Das is Counsel in Perkins Coie LLP’s commercial litigation practice group. Dr. Das’s practice focuses on patent litigation and technology licensing. Dr. Das has over ten years of patent and trade secret litigation experience, and before joining Perkins Coie worked in the semiconductor industry providing legal counsel on intellectual property-related issues affecting numerous technologies, including hybrid DRAM memory, flash memory, LED, display, and solar. Dr. Das received his Ph.D. from Caltech and taught undergraduate and graduate courses in mathematics for six years prior to embarking on his legal career. In addition to his work at Perkins Coie and his in-house legal experience, Dr. Das has worked for Davis Wright Tremaine and Merchant & Gould.
Dr. Das is passionate about community service and pro bono activities and has argued immigration and prisoners' rights cases before the U.S. Court of Appeals for the Ninth Circuit. He has served on the Boards of the King County Bar Association, the King County Bar Foundation, the Asian Bar Association of Washington, and the South Asian Bar Association of Washington. Dr. Das graduated with high honors, Order of the Coif, and The Order of Barristers from University of Washington Law School.
Dr. Das is admitted to practice before the Supreme Court of the United States, the Courts of Appeal for the Federal Circuit and the Ninth Circuit, and the United States District Courts for the Idaho, the Eastern District of Texas, and the Eastern and Western District of Washington. He has also litigated patent and trade secret cases in U.S. District Courts in California, Delaware, Florida, Maryland, Mississippi, New York, and Wyoming.